Gas sensing chip, manufacturing method thereof and gas sensing device

TW202632264APending Publication Date: 2026-08-01NATIONAL TSING HUA UNIVERSITY
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NATIONAL TSING HUA UNIVERSITY
Filing Date
2025-01-23
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001069796_001
    Figure TWG2TA001069796_001
  • Figure TWG2TA001069796_002
    Figure TWG2TA001069796_002
  • Figure TWG2TA001069796_003
    Figure TWG2TA001069796_003
Patent Text Reader

Abstract

According to the present disclosure, a manufacturing method of a gas sensing chip includes the following steps. A two-dimensional semiconductor is provided. A gas selectivity-enhancing compound is coated on a surface of the two-dimensional semiconductor. The gas selectivity-enhancing compound includes at least one of hexagonal boron nitride, zeolitic imidazolate framework and copper phthalocyanine. Therefore, by coating the gas selectivity-enhancing compound on the two-dimensional semiconductor, the sensitivity, selectivity and stability of the gas sensing chip can be improved.
Need to check novelty before this filing date? Find Prior Art