Air-cooling device for semiconductor chip testing

Abstract

This invention provides an air-cooled cooling device for semiconductor wafer testing with optimized heat transfer efficiency, comprising: a lower frame; a test module for accommodating a semiconductor wafer; an upper cover disposed on the upper part of the lower frame; a cooling module coupled to the upper cover for dissipating heat generated from the semiconductor wafer; and a pressing module for contact between the test module and the cooling module; wherein the cooling module may consist of a plurality of heat pipes, a plurality of heat dissipation fins, and a cooling fan, wherein the plurality of heat dissipation fins are respectively penetrated by the heat pipes, and the cooling fan is used to blow air in a direction perpendicular to the stacking direction of the heat dissipation fins; the plurality of heat pipes may be pressed into the upper surface of the pressing module for fixed connection. none

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