Non-spring type package socket
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- JGTECHNOLOGYCO LTD
- Filing Date
- 2025-01-22
- Publication Date
- 2026-08-01
AI Technical Summary
Conventional IC terminal testing methods face challenges with miniaturization due to the need for spring-type adapters that occupy space, which is not compatible with Package on Package (PoP) technology's vertical stacking and miniaturization requirements.
A non-spring-type encapsulation test socket replaces the adapter board with conductive adhesive or conductive layers as the conductive medium, allowing for miniaturization by using single-action probes and non-elastic metal conductors that can move during testing.
The solution ensures stable electrical connections and avoids inaccurate testing by allowing the conductive medium to compress and move, thus accommodating miniaturized designs without compromising testing accuracy.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer packaging and testing technology, and in particular to a non-spring-type packaging and testing socket. Prior Technology
[0002] Note that during conventional integrated circuit (IC) terminal testing, the electrical contacts or pins of the IC need to be pressed against the pogo pins in the test socket to transmit the test signal to the tester for determining the IC's quality. However, with the miniaturization of electronic products in recent years, Package on Package (PoP) technology has gained increasing attention. PoP uses advanced wafer thinning and related packaging technologies to vertically stack multiple components, integrating ICs in the bottom layer and memory in the top layer to provide a complete memory system. This offers advantages such as miniaturization and simplified circuit board design. Summary of the Invention
[0003] This invention is a non-spring-type encapsulation test socket. Its main purpose is to eliminate the adapter board inside the top socket and replace it with conductive adhesive or conductive layer as the conductive medium between the metal conductor and the double data rate memory, thereby achieving miniaturization.
[0004] To achieve the above objectives and effects, the present invention provides a non-spring-type encapsulation test socket, comprising: a bottom socket with a recessed bottom slot, the bottom slot having a plurality of single-action probes; a test machine having a top socket corresponding to the bottom slot and a double data rate memory (DRAM) internally adjacent to the top socket; and a plurality of metal conductors disposed inside the top socket, one end having conductive adhesive electrically connected to the DRAM, and the other end having a probe.
[0005] To achieve the above objectives and effects, another embodiment of the present invention provides a non-spring-type packaged test socket, comprising: a bottom socket with a recessed bottom slot, the bottom slot having a plurality of single-action probes; a test machine having a top socket corresponding to the bottom slot and a double data rate memory (DRAM) internally adjacent to the top socket, the outer surface of the top socket having a conductive layer electrically connected to the DRAM; and a plurality of metal conductors disposed inside the top socket, one end of which is electrically connected to the conductive layer, and the other end having a probe.
[0006] To achieve the above objectives and effects, another embodiment of the present invention provides a non-spring-type packaging test socket, comprising: a bottom socket with a recessed bottom slot, the bottom slot having a plurality of single-action probes; a test machine having a top socket corresponding to the bottom slot and a double data rate memory (DRAM) internally adjacent to the top socket, the outer surface of the top socket having a conductive layer, the conductive layer having a plurality of conductive adhesives internally, and the conductive layer and each conductive adhesive being electrically connected to the DRAM; and a plurality of metal conductors disposed inside the top socket, one end of which is electrically connected to each of the conductive adhesives, and the other end having a probe. Simple Explanation of the Diagram
[0007] The first figure is an exploded plan view of the first embodiment of the present invention. The second figure is a planar assembly diagram of the first embodiment of the present invention. The third figure is a partial planar composite diagram (a) of the first embodiment of the present invention. Figure 4 is a partial planar composite diagram (II) of the first embodiment of the present invention. Figure 5 is a schematic diagram of the operation of the metal guide in the first embodiment of the present invention (I). Figure 6 is a schematic diagram (II) of the operation of the metal guide in the first embodiment of the present invention. Figure 7 is a partial planar composite diagram (I) of the second embodiment of the present invention. Figure 8 is a partial planar composite diagram (II) of the second embodiment of the present invention. Figure 9 is a partial planar composite diagram (I) of the third embodiment of the present invention. Figure 10 is a partial planar composite diagram (II) of the third embodiment of the present invention. Implementation
[0008] The accompanying drawings are provided in detail below, with reference to the embodiments. The drawings used herein are for illustrative purposes only and to assist in the description. They may not represent the actual proportions and precise configurations of the invention after implementation. Therefore, the scope of the invention in actual implementation should not be limited by the proportions and configurations of the accompanying drawings. This is hereby stated.
[0009] Please refer to Figures 1 to 6, which show a non-spring-type packaging test socket according to the first embodiment of the present invention, comprising:
[0010] The bottom socket 1 has a recessed bottom slot 10, and a plurality of single-action probes 11 are provided in the middle of the bottom slot 10.
[0011] The test equipment 2 has a top socket 20 corresponding to the bottom slot 10. Inside the test equipment 2, adjacent to the top socket 20, is a Double Data Rate Memory (DDR) 21. The DDR Memory 21 is electrically connected to a plurality of conductive solder balls 210 located inside the top socket 20. In this embodiment, the top socket 20 is made of metal or an electrically conductive material.
[0012] A plurality of metal conductors 3 are disposed inside the top socket 20, and one end of each conductor has conductive adhesive 4 electrically connected to each conductive solder ball 210 of the Double Data Rate Memory 21. Conversely, one end of the conductive adhesive 4 has a probe 30 protruding from the outside of the top socket 20. In this embodiment, the conductive adhesive 4 contains a plurality of conductive particles 40 with different conductivity densities. For example, the conductivity density of the plurality of conductive particles 40 in the third figure is small, and the conductivity density of the plurality of conductive particles 40 in the fourth figure is large. Each conductive solder ball 210 is correspondingly disposed with each metal conductor 3, and each metal conductor 3 is made of a non-elastic material.
[0013] In practice, during the final test to determine if the chip 5 is abnormal, the bottom socket 1 is placed on the load board 6, and the chip 5 is placed above each individual probe 11. Next, the test machine 2 is driven to press towards the bottom socket 1, causing the top socket 20 to be inserted into the bottom slot 10 of the bottom socket 1, with the probes 30 of each metal conductor 3 protruding from the top socket 20 and making electrical contact with the chip 5 (as shown in Figure 5). At this time, current is applied to the load board 6, passing through the chip 5 and then through each metal conductor 3 and conductive adhesive 4 to the double data rate memory 21 for electrical testing. During the electrical test, the test machine 2 continues to press, at which point the conductive adhesive 4 is elastically compressed, allowing the probes 30 of each metal conductor 3 to be inserted into the top socket 20 (as shown in Figure 6). In other words, the conductive adhesive 4 of the present invention not only serves as a conductive medium between the metal conductor 3 and the double data rate memory 21, but also allows the metal conductor 3 to move up and down during the testing process, ensuring the electrical connection between the metal conductor 3, the chip 5 and the load board 6, and avoiding inaccurate testing of the chip 5 by the metal conductor 3.
[0014] Please refer to Figures 1 through 8, which show the non-spring-type packaging test socket of the second embodiment of the present invention, including:
[0015] The bottom socket 1 has a recessed bottom slot 10, and a plurality of single-action probes 11 are provided in the middle of the bottom slot 10.
[0016] The test equipment 2 has a top socket 20 corresponding to the bottom slot 10. Inside the test equipment 2, adjacent to the top socket 20, is a Double Data Rate Memory (DDR) 21. The DDR 21 is electrically connected to a plurality of conductive solder balls 210. A conductive layer 7 is provided on the outer surface of the top socket 20 corresponding to the DDR 21, covering the entire surface of the top socket 20 and electrically connected to each conductive solder ball 210 of the DDR 21. In this embodiment, the top socket 20 is made of metal or a conductive material.
[0017] A plurality of metal conductors 3 are disposed inside the top socket 20, with one end electrically connected to the entire conductive layer 7, and the other end having a probe 30 protruding from the outside of the top socket 20. In this embodiment, the conductive layer 7 contains a plurality of conductive particles 70 with different conductivity densities. For example, the conductivity density of the plurality of conductive particles 70 in Figure 7 is small, and the conductivity density of the plurality of conductive particles 40 in Figure 8 is large. Each metal conductor 3 is correspondingly disposed to each conductive solder ball 210, and each metal conductor 3 is made of a non-elastic material.
[0018] In practice, during the final test to determine if the chip 5 is abnormal, the bottom socket 1 is placed on the load board 6, and the chip 5 is placed above each individual probe 11. Next, the test machine 2 is driven to press towards the bottom socket 1, causing the top socket 20 to be inserted into the bottom slot 10 of the bottom socket 1, with the probes 30 of each metal conductor 3 protruding from the top socket 20 and making electrical contact with the chip 5. At this time, current is applied to the load board 6, passing through the chip 5 and then through each metal conductor 3 and the conductive layer 7 to the double data rate memory 21 for electrical testing. During the electrical test, the test machine 2 continues to press, at which point the conductive layer 7 is elastically compressed, allowing the probes 30 of each metal conductor 3 to be inserted into the top socket 20. In other words, the conductive layer 7 of the present invention not only serves as a conductive medium between the metal conductor 3 and the double data rate memory 21, but also allows the metal conductor 3 to move up and down during the testing process, ensuring the electrical connection between the metal conductor 3, the chip 5 and the load board 6, and avoiding inaccurate testing of the chip 5 by the metal conductor 3.
[0019] Please refer to Figures 1 through 10, which show the non-spring-type packaging test socket of the third embodiment of the present invention, including:
[0020] The bottom socket 1 has a recessed bottom slot 10, and a plurality of single-action probes 11 are provided in the middle of the bottom slot 10.
[0021] The test equipment 2 has a top socket 20 corresponding to the bottom slot 10. Inside the test equipment 2, adjacent to the top socket 20, is a Double Data Rate (DDR) memory 21. The DDR memory 21 is electrically connected to a plurality of conductive solder balls 210. A conductive layer 7 is provided on the surface of the top socket 20 corresponding to the DDR memory 21. The conductive layer 7 covers the entire surface of the top socket 20 and contains a plurality of conductive adhesives 4. The conductive layer 7 and each conductive adhesive 4 are electrically connected to each conductive solder ball 210 of the DDR memory 21. In this embodiment, the top socket 20 is made of metal or an electrically conductive material.
[0022] A plurality of metal conductors 3 are disposed inside the top socket 20, with one end electrically connected to the conductive layer 7 and each of the conductive adhesives 4 inside it, and the other end having a probe head 30 protruding from the outside of the top socket 20. In this embodiment, the conductive adhesive 4 and the conductive layer 7 contain a plurality of conductive particles 40 and 70 with different conductivity densities. For example, the conductivity density of the plurality of conductive particles 40 and 70 in Figure 9 is small, and the conductivity density of the plurality of conductive particles 40 in Figure 10 is large. Each metal conductor 3 is correspondingly disposed with each conductive solder ball 210, and each metal conductor 3 is made of a non-elastic material.
[0023] In practice, during the final test to determine if the chip 5 is abnormal, the bottom socket 1 is placed on the load board 6, and the chip 5 is placed above each individual probe 11. Next, the test machine 2 is driven to press towards the bottom socket 1, causing the top socket 20 to be inserted into the bottom slot 10 of the bottom socket 1, with the probes 30 of each metal conductor 3 protruding from the top socket 20 and making electrical contact with the chip 5. At this time, current is applied to the load board 6, passing through the chip 5 and then through each metal conductor 3, conductive layer 7, and conductive adhesive 4 to the double data rate memory 21 for electrical testing. During the electrical test, the test machine 2 continues to press, at which point the conductive layer 7 and conductive adhesive 4 are elastically compressed, allowing the probes 30 of each metal conductor 3 to be inserted into the top socket 20. In other words, the conductive layer 7 and conductive adhesive 4 of the present invention not only serve as a conductive medium between the metal conductor 3 and the double data rate memory 21, but also allow the metal conductor 3 to move up and down during the testing process, ensuring the electrical connection between the metal conductor 3, the chip 5 and the load board 6, and avoiding inaccurate testing of the chip 5 by the metal conductor 3.
[0024] As described above, in the first embodiment, the present invention employs a technique where conductive adhesive 4 and a metal conductor 3 are disposed inside the top socket 20, and the conductive adhesive 4 is electrically connected between the metal conductor 3 and the double data rate memory 21. In the second embodiment, the present invention employs a technique where the metal conductor 3 is disposed inside the top socket 20, the conductive layer 7 is disposed outside the top socket 20, and the conductive layer 7 is electrically connected between the metal conductor 3 and the double data rate memory 21. In the third embodiment, the present invention employs a technique where the metal conductor 3 is disposed inside the top socket 20, the conductive layer 7 is disposed outside the top socket 20, and the conductive layer 7 is provided with a plurality of conductive adhesives 4, and the conductive layer 7 and the conductive adhesive 4 are electrically connected between the metal conductor 3 and the double data rate memory 21. Accordingly, regardless of whether the present invention adopts the first embodiment, the second embodiment, or the third embodiment, the common technical means is to use conductive adhesive 4 or conductive layer 7 to replace the adapter plate originally located inside the top socket 20, and by utilizing the elastic stretching characteristics of conductive adhesive 4 or conductive layer 7, the volume of the top socket 20 is reduced, thereby improving the problem of the limitation of miniaturization of the packaging test socket.
[0025] In conclusion, the structure disclosed in this invention has an unprecedented innovative construction, so its "novelty" is beyond doubt. Furthermore, this invention has a greater improvement in efficiency than conventional structures, thus it also has "progressiveness". It fully complies with the provisions of the Patent Law of our country concerning invention patent applications. Therefore, we hereby file a patent application with your office in accordance with the law, and earnestly request your office to grant patent rights to this invention as soon as possible. We would be very grateful for your help.
[0026] 1: Bottom socket 10: Bottom slot 11: Single-action probe 2: Testing equipment 20: Top socket 21: Double Data Rate Memory 210: Conductive solder ball 3: Metal conductors 30: Probe head 4: Conductive adhesive 40, 70: Conductive particles 5: Chip 6: Load board 7: Conductive layer
Claims
1. A non-spring-type packaging test socket, comprising: The bottom socket has a recessed bottom slot, and a plurality of single-action probes are provided in the middle of the bottom slot; The testing equipment has a top socket corresponding to the bottom slot. Inside the testing equipment, adjacent to the top socket, is a Double Data Rate (DMR) memory. A plurality of metal conductors are located inside the top socket, each having conductive adhesive at one end electrically connected to the DMR memory, and a probe at the other end. The DMR memory is electrically connected to a plurality of conductive solder balls, each solder ball located inside the top socket and electrically connected to the conductive adhesive of each metal conductor. The conductive adhesive contains a plurality of conductive particles with different conductivity densities, each conductive particle electrically connected to each conductive solder ball and each metal conductor.
2. The non-spring-loaded encapsulation test socket as described in claim 1, wherein the top socket is made of metal.
3. The non-spring-loaded encapsulated test socket as described in claim 1, wherein the top socket is made of an electrically conductive material.
4. The non-spring-type encapsulation test socket as described in claim 1, wherein each metal conductor is made of a non-elastic material.
5. The non-spring-loaded packaging test socket as described in claim 1, wherein each single-action probe of the bottom socket is provided with a chip, and the probe head of each metal conductor protrudes from the outside of the top socket and contacts the chip.
6. A non-spring-loaded packaging test socket, comprising: The bottom socket has a recessed bottom slot, and a plurality of single-action probes are provided in the middle of the bottom slot; The testing equipment has a top socket corresponding to the bottom slot. A Double Data Rate (DFR) memory is located inside the testing equipment adjacent to the top socket. A conductive layer is provided on the outer surface of the top socket, and a plurality of conductive adhesives are provided inside the conductive layer. The conductive layer and each conductive adhesive are electrically connected to the DFR memory. A plurality of metal conductors are located inside the top socket, with one end electrically connected to the conductive layer and each conductive adhesive inside the conductive layer, and the other end having a probe. The DFR memory is electrically connected to a plurality of conductive solder balls. Each conductive solder ball is located inside the top socket and is electrically connected to the conductive layer and each conductive adhesive. The conductive layer and the conductive adhesive each contain a plurality of conductive particles with different conductivity densities, and each conductive particle is electrically connected to each conductive solder ball and each metal conductor.
7. The non-spring-loaded encapsulated test socket as described in claim 6, wherein the top socket is made of metal.
8. The non-spring-loaded encapsulated test socket as described in claim 6, wherein the top socket is made of an electrically conductive material.
9. The non-spring-loaded test housing as described in claim 6, wherein each metal conductor is made of a non-elastic material.
10. The non-spring-loaded package test socket as described in claim 6, wherein each single-action probe of the bottom socket is provided with a chip, and the probe head of each metal conductor protrudes from the outside of the top socket and contacts the chip.