Test socket
The test socket's dual heat dissipation structure addresses overheating issues in conductive pins by using insulating and metallic materials to absorb and release heat, enhancing reliability and stability in inspection devices.
Patent Information
- Application Number
- TW114146996
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-24
- Filing Date
- 2025-12-02
- Publication Date
- 2026-08-01
AI Technical Summary
Existing inspection devices face issues with heat generation in conductive pins, leading to overheating and reduced reliability and efficiency, which can damage external terminals and shorten the lifespan of the inspection device or object being inspected.
A test socket design incorporating a heat dissipation section with a dual structure of insulating and metallic materials, where the insulating material surrounds the conductive pin to absorb heat and the metallic material releases it to the outside, enhancing heat dissipation efficiency.
Effectively dissipates heat generated in conductive pins, improving the reliability and stability of the inspection process by preventing overheating and extending the lifespan of the device and object being inspected.