Probe card for an apparatus for testing electronic devices with improved thermal control

TW202632292APending Publication Date: 2026-08-01TECHNOPROBE
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TECHNOPROBE
Filing Date
2025-12-18
Publication Date
2026-08-01

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Abstract

A probe card (20) suitable for insertion into an apparatus for testing electronic devices is described, the probe card (20) comprising: at least one probe head (11) accommodating a plurality of contact probes (13), each contact probe (13) having at least one first end (13A) adapted to abut against a contact pad (15A) of a device under test (15), and a second end (13B) adapted to abut against a corresponding contact pad formed on a first surface (FA) of a space transformer (14) facing the device under test (15); and a motherboard (17) connected to the space transformer (14) via an interconnect layer (18) having a plurality of mechanical and electrical connection elements (18A) located between the space transformer (14) and the motherboard (17). Appropriately, the probe card (20) also includes a microfluidic cooling system (30, 40) comprising one or more microfluidic channels (34A, 34B, 44) with corresponding microfluidic pathways (33A, 33B, 43) in which cooling fluid circulates, the microfluidic channels (34A, 34B, 44) being in thermal contact with the space converter (14) to collect and dissipate heat from there. A probe card (20) adapted to be inserted in an apparatus for testing electronic devices is described, said probe card (20) comprising at least one probe head (11) housing a plurality of contact probes (13), each contact probe (13) having at least one first end portion (13A) adapted to abut onto contact pads (15A) of a device under test (15) and a second end portion (13B) adapted to abut onto corresponding contact pads formed on a first face (FA) of a space transformer (14) facing the device under test (15), as well as a main board (17) connected to the space transformer (14) by means of an interconnection layer (18) provided with a plurality of mechanical and electrical connection elements (18A) between the space transformer (14) and the main board (17).Suitably, the probe card (20) further comprises a microfluidic cooling system (30, 40) including one or more microfluidic channels (34A, 34B, 44) provided with respective microfluidic passages (33A, 33B, 43) in which a cooling fluid circulates, said microfluidic channels (34A, 34B, 44) being in thermal contact with the space transformer (14) to collect and dissipate heat therefrom.
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