Probe card for an apparatus for testing electronic devices with improved thermal control

Abstract

A probe card (20) suitable for insertion into an apparatus for testing electronic devices is described, the probe card (20) comprising: at least one probe head (11) accommodating a plurality of contact probes (13), each contact probe (13) having at least one first end (13A) adapted to abut against a contact pad (15A) of a device under test (15), and a second end (13B) adapted to abut against a corresponding contact pad formed on a first surface (FA) of a space transformer (14) facing the device under test (15); and a main board (17) connected to the space transformer (14) and one or more active devices (19; 19A, 19B) accommodated on the first surface (FA) of the space transformer (14) and in thermal contact with the space transformer (14). Appropriately, the probe card (20) also includes a microfluidic cooling system (30) comprising at least one manifold (31) having one or more microfluidic channels (32, 33) in which cooling fluid circulates, the microfluidic channels (32, 33) being in direct or indirect thermal contact with active devices (19; 19A, 19B) to collect and dissipate heat generated by the active devices (19; 19A, 19B) as active thermal power (PT2). A probe card (20) adapted to be inserted in an apparatus for testing electronic devices is described, said probe card (20) comprising at least one probe head (11) housing a plurality of contact probes (13), each contact probe (13) having at least one first end portion (13A) adapted to abut onto contact pads (15A) of a device under test (15) and a second end portion (13B) adapted to abut onto corresponding contact pads formed on a first face (FA) of a space transformer (14) facing the device under test (15), as well as a main board (17) connected to the space transformer (14) and one or more active devices (19; 19A, 19B) housed on the first face (FA) of the space transformer (14) and in thermal contact with said space transformer (14).Suitably, the probe card (20) further comprises a microfluidic cooling system (30) including at least one manifold (31) provided with one or more microfluidic channels (32, 33) in which a cooling fluid circulates, said microfluidic channels (32, 33) being in direct or indirect thermal contact with the active devices (19; 19A, 19B) to collect and dissipate heat produced by said active devices (19; 19A, 19B) as active thermal power (PT2).

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