探針承載組件之製程

Abstract

本創作係一種探針承載組件之製程，其係利用模塑成型設備執行並包含承載基部成型步驟及定位框部成型步驟，承載基部成型步驟係於模塑成型設備以基部模具模塑成型平板狀的承載基部，該承載基部上具有陣列排列的多數探針孔，而定位框部成型步驟係將承載基部置入框部模具，透過模塑成形設備於承載基部的外圍模塑成型定位框部，藉由承載基部成型步驟先成型出厚度差異較小之承載基部，以提高所述承載基部的探針孔之尺寸精度，再透過進行定位框部成型步驟成型定位框部，藉此能在承載基部的探針孔具備有一定尺寸精度下，確實降低所述探針承載組件的製造成本及製造時間。

Description

Technical Field

[0001] This invention relates to a process for manufacturing a probe carrier component, and more particularly to a process for manufacturing a probe carrier component. Prior Technology

[0002] In current semiconductor device testing equipment, a test connector is used to perform functional testing of semiconductor devices. The test connector includes a circuit board and a probe carrier assembly disposed on the circuit board. The probe carrier assembly can hold a plurality of probes arranged in an array. When performing semiconductor device testing, the semiconductor device can be placed on the probe carrier assembly, so that the semiconductor device can be electrically connected to the circuit board through the probes inside the probe carrier assembly, thereby achieving the purpose of testing the semiconductor device.

[0003] The probe carrier assembly includes stacked carrier components, wherein the carrier components can be divided into a positioning seat for positioning semiconductor elements, a carrier disk disposed below the positioning seat, and a carrier substrate disposed below the carrier disk and connected to the circuit board. The positioning seat, carrier disk, and carrier substrate each have a carrier base and a positioning frame surrounding the carrier base. The carrier base has a plurality of probe holes arranged in an array, and the positioning frame has a plurality of positioning pins and a plurality of positioning pin holes. When the plurality of carrier components are stacked, the plurality of carrier components are engaged and positioned by the positioning pins and positioning pin holes of the positioning frame, and the probe holes on each carrier component are aligned and connected to each other, so that the probes can be installed in the probe holes respectively.

[0004] In order to ensure that the probe holes of each bearing component of the probe bearing assembly are properly aligned vertically, the position and size accuracy of the probe holes of each bearing component are required to be high. If the probe holes of the bearing base and the positioning structure on the positioning frame are directly molded in one piece, the thickness difference between the bearing base and the positioning frame is large, which can lead to poor accuracy of the finished product and thus cause the probe hole positions to not match.

[0005] Therefore, in the current manufacturing process of the probe carrier components, the outer shape of the carrier base and the positioning frame is usually molded first, and then the probe holes are formed by high-precision drilling. However, the probe holes of each carrier component are densely distributed and numerous, which not only takes a long time to process, but also requires the carrier component to be re-processed if there is a drilling error during the process, resulting in higher operating and manufacturing costs. Summary of the Invention

[0006] The main purpose of this invention is to provide a process for manufacturing a probe carrier assembly, thereby improving the current problems of high processing time and cost required for manufacturing probe carrier assemblies.

[0007] To achieve the aforementioned objectives, the manufacturing process of the probe carrier assembly is performed using a molding machine. The manufacturing process of the probe carrier assembly includes: The base molding step involves molding a flat base in the shape of a base mold using a molding equipment. The base has a plurality of probe holes arranged in an array. Positioning frame forming steps: The supporting base is placed into a frame mold, and a positioning frame is formed on the periphery of the supporting base through the molding equipment.

[0008] The manufacturing process of this probe carrier assembly is applicable to carrier components such as positioning seats, carrier disks, and carrier substrates. The manufacturing process of the probe carrier assembly mainly involves first forming a carrier base with probe holes through a carrier base forming step, and then forming a positioning frame around the carrier base through a positioning frame forming step. By first forming a flat carrier base, the impact of thickness differences during molding on accuracy can be reduced, thereby significantly improving the accuracy of carrier base forming. Then, by forming a positioning frame around the carrier base through the positioning frame forming step, the impact on the dimensional accuracy of the probe holes in the carrier base can be reduced. In this way, the manufacturing cost and manufacturing time of the probe carrier assembly can be effectively reduced while ensuring that the probe holes in the carrier base have a certain dimensional accuracy. Simple Explanation of the Diagram

[0009] Figure 1: A block diagram of the manufacturing process of the probe carrier component of this invention. Figure 2: A schematic diagram of the substrate forming steps in the manufacturing process of the probe carrier component of this invention. Figure 3: A three-dimensional appearance diagram of the substrate after the manufacturing process of the probe carrier component of this invention is completed. Figure 4: A schematic diagram of the positioning frame forming steps in the manufacturing process of the probe carrier component of this invention. Figure 5: A three-dimensional appearance diagram of the positioning frame after the manufacturing process of the probe carrier component of this invention is completed. Figure 6: A schematic diagram of the side cross-section of Figure 5. Figure 7: An exploded three-dimensional view of the probe carrier component manufactured in this invention. Figure 8: A schematic cross-sectional view of the probe carrier assembly formed by the manufacturing process of the probe carrier assembly of this invention. Implementation

[0010] Please refer to Figure 1, which shows a preferred embodiment of the manufacturing process of the probe carrier component of this invention. The process is performed using a molding equipment and includes a carrier base molding step and a positioning frame molding step.

[0011] The manufacturing process of this probe carrier assembly can be applied to the production of carrier components such as the positioning seat 11, the carrier plate 12, and the carrier substrate 13 of the probe carrier assembly 10. The following description will take the forming of the positioning seat 11 of the probe carrier assembly 10 as an example.

[0012] As shown in Figures 1 to 3, in the base forming step, the molding equipment can mold a flat base 14a with a base mold 20. The base 14a has a plurality of probe holes 141 arranged in an array. After the base 14a is formed, the positioning frame forming step is performed.

[0013] As shown in Figures 1, 4 to 6, in the positioning frame forming step, the supporting base 14a can be placed into a frame mold 21, and a positioning frame 15a can be molded around the supporting base 14a through the molding equipment.

[0014] The molding process of the supporting base and the positioning frame is injection molding. Furthermore, the supporting base 14a and the positioning frame 15a can be made of heat-resistant engineering plastic materials, such as PEEK (polyether ether ketone), PEI (polyether amide), PAI (polyamide amide), PI (polyamide), or PPS (polyphenylene sulfide).

[0015] As mentioned above, the manufacturing process of the probe carrier assembly can be applied to the production of carrier components such as the positioning seat 11, carrier disk 12 and carrier substrate 13 of the probe carrier assembly 10. Therefore, during the production of carrier components such as the positioning seat 11, carrier disk 12 and carrier substrate 13, different base molds 20 and frame molds 21 will be selected for each carrier component.

[0016] As shown in Figures 5 and 6, when the positioning seat 11 of the carrier component is formed by the process of the probe carrier component, the positioning frame portion 15a of the positioning seat 11 includes an outer ring wall 151, the inner edge of the outer ring wall 151 is formed with a plurality of guide inclined surfaces 152, and the outer ring wall 151 has a plurality of positioning pin holes 153.

[0017] As shown in Figures 7 and 8, when the carrier disk 12 is formed using the process of the probe carrier assembly, the positioning frame portion 15b of the carrier disk 12 includes a frame 154, an extending flange 155, a plurality of positioning pins 156, and a plurality of mating protrusions 157. The frame 154 surrounds the periphery of the carrier base 14b, the extending flange 155 protrudes from the periphery of the frame 154, the plurality of positioning pins 156 and the plurality of mating protrusions 157 protrude from the upper and lower sides of the frame 154 respectively, and the extending flange 155 forms a plurality of positioning slots 158.

[0018] As shown in Figures 7 and 8, when the carrier substrate 13 is formed using the process of the probe carrier assembly, the positioning frame portion 15c of the carrier substrate 13 has a plurality of mating holes 159.

[0019] As shown in Figures 7 and 8, the positioning seat 11, the carrier plate 12, and the carrier substrate 13 can be stacked and positioned on each other. The carrier plate 12 can be disposed on the carrier substrate 13, and the mating protrusions 157 of the carrier plate 12 can be respectively inserted into the mating holes 159 of the carrier substrate 13. The positioning seat 11 can be disposed on the carrier plate 12, and the positioning pins 156 of the carrier plate 12 can be respectively inserted into the positioning pin holes 153 of the positioning seat 11. At the same time, the probe holes 141 on the carrier bases 14a, 14b, and 14c of the positioning seat 11, the carrier plate 12, and the carrier substrate 13 can be aligned and connected, and can respectively provide probe mounting.

[0020] As shown in Figures 1 to 7, during molding, large differences in the overall thickness of the product or higher structural complexity will affect the dimensional accuracy of the product. Therefore, in order to improve the dimensional accuracy of the bearing bases 14a, 14b, and 14c with probe holes 141 in the bearing components of the probe bearing assembly 10, the manufacturing process of this probe bearing assembly is to separate each bearing component of the bearing assembly into two parts: flat bearing bases 14a, 14b, and 14c, and positioning frame parts 15a, 15b, and 15c surrounding the bearing bases 14a, 14b, and 14c with large thickness variations. Furthermore, during the bearing base molding step, parts with smaller thickness variations are pre-molded. The relatively simple structure of the bearing bases 14a, 14b, and 14c reduces the impact of thickness differences and structural complexity on accuracy during molding, thereby improving the dimensional accuracy of the probe holes 141 in the bearing bases 14a, 14b, and 14c. Furthermore, through the positioning frame forming step, positioning frames 15a, 15b, and 15c are formed around the bearing bases 14a, 14b, and 14c, which reduces the impact on the dimensional accuracy of the probe holes 141 in the bearing bases 14a, 14b, and 14c. In this way, while ensuring a certain dimensional accuracy of the probe holes 141 in the bearing bases 14a, 14b, and 14c, the manufacturing cost and manufacturing time of the probe bearing assembly 10 are effectively reduced.

[0021] In summary, the manufacturing process of the probe carrier assembly of this invention involves forming flat plate-shaped carrier bases 14a, 14b, and 14c with probe holes 141 through a carrier base molding step. This reduces the impact of thickness differences and structural complexity during molding on accuracy, and improves the dimensional accuracy of the probe holes 141 in the carrier bases 14a, 14b, and 14c. Then, positioning frames 15a, 15b, and 15c are formed through a positioning frame molding step. This effectively reduces the manufacturing cost and time of the probe carrier assembly 10 while ensuring that the probe holes 141 in the carrier bases 14a, 14b, and 14c have a certain dimensional accuracy.

[0022] 10: Probe carrier assembly 11: Positioning seat 12: Support plate 13: Supporting substrate 14a, 14b, 14c: Supporting base 141: Probe Hole 15a, 15b, 15c: Positioning frame 151: Outer ring wall 152: Guide ramp 153: Locating pin hole 154: Frame 155: Extended flange 156: Positioning pin 157: Matching convex post 158: Positioning slot hole 159: Mating hole 20: Base mold 21: Frame mold

Claims

1. A process for manufacturing a probe carrier assembly, which is performed using a molding apparatus, the process comprising: a carrier base forming step: molding a flat carrier base in the molding apparatus using a base mold, the carrier base having a plurality of probe holes arranged in an array; and a positioning frame forming step: placing the carrier base into a frame mold, and molding a positioning frame around the carrier base using the molding apparatus, the positioning frame including an outer ring wall, the inner edge of the outer ring wall having a plurality of guide slopes, and the outer ring wall having a plurality of positioning pin holes.

2. The manufacturing process of the probe carrier assembly as described in claim 1, wherein the molding of the carrier base forming step and the positioning frame forming step is by injection molding.

3. The manufacturing process of the probe carrier assembly as described in claim 1, wherein the carrier base and the positioning frame are made of heat-resistant engineering plastic material.

4. The manufacturing process of the probe carrier assembly as described in claim 2, wherein the carrier base and the positioning frame are made of heat-resistant engineering plastic material.

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