Wafer testing system and operating method of the same

TW202632304APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Filing Date
2025-06-20
Publication Date
2026-08-01

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    Figure TWG2TA001070156_003
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Abstract

A wafer testing system includes a first circuit, a converter circuit and a testing system. The first circuit is configured to generate a radio frequency (RF) signal, the RF signal having a first oscillation frequency. The converter circuit is coupled to the first circuit, configured to receive the RF signal, and to convert the RF signal into a first voltage representative of a value of the first oscillation frequency. The first voltage is a direct current voltage. The testing system is coupled to the converter circuit, and configured to receive the first voltage, and to perform a wafer acceptance test (WAT) on the first oscillation frequency in response to the first voltage.
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