Optical device

TW202632321APending Publication Date: 2026-08-01FLEXENABLE TECH LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
FLEXENABLE TECH LTD
Filing Date
2025-11-28
Publication Date
2026-08-01

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Abstract

There is disclosed a stack for processing a device layer on a rigid substrate, including a first stack comprising: a device substrate layer adjacent the device layer; a double-sided UV adhesive layer adjacent the device substrate layer; a laser-light debond layer adjacent the double-sided UV adhesive layer; and a rigid substrate adjacent the laser / light debond layer.
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