Semiconductor structure and method for fabricating the same

TW202632332APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Filing Date
2025-02-19
Publication Date
2026-08-01

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    Figure TWG2TA001070005_001
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    Figure TWG2TA001070005_002
  • Figure TWG2TA001070005_003
    Figure TWG2TA001070005_003
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Abstract

A semiconductor structure is provided, which includes a substrate and a waveguide layer formed on the substrate. The waveguide layer includes a plurality of waveguides. The semiconductor structure further includes a plurality of processing dies arranged in an array on the waveguide layer, and a plurality of electric integrated circuit (EIC) dies arranged at a periphery of the array on the waveguide layer and electrically coupled with the plurality of processing dies. At least two of the plurality of EIC dies arranged at opposite edges of the array are coupled to each other through a corresponding waveguide of the plurality of waveguides.
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