Semiconductor structure and method for fabricating the same
TW202632332APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2025-02-19
- Publication Date
- 2026-08-01
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Figure TWG2TA001070005_001 
Figure TWG2TA001070005_002 
Figure TWG2TA001070005_003
Abstract
A semiconductor structure is provided, which includes a substrate and a waveguide layer formed on the substrate. The waveguide layer includes a plurality of waveguides. The semiconductor structure further includes a plurality of processing dies arranged in an array on the waveguide layer, and a plurality of electric integrated circuit (EIC) dies arranged at a periphery of the array on the waveguide layer and electrically coupled with the plurality of processing dies. At least two of the plurality of EIC dies arranged at opposite edges of the array are coupled to each other through a corresponding waveguide of the plurality of waveguides.
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