Photonic fanout interposer
TW202632343APending Publication Date: 2026-08-01LIGHTMATTER INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-12-09
- Publication Date
- 2026-08-01
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Abstract
Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled to the glass waveguides through pluggable optical couplers, evanescent coupling, and / or edge coupling.
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