Photonic fanout interposer

TW202632343APending Publication Date: 2026-08-01LIGHTMATTER INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-12-09
Publication Date
2026-08-01

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Abstract

Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled to the glass waveguides through pluggable optical couplers, evanescent coupling, and / or edge coupling.
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