Optical devices and methods of forming the same

TW202632344APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Filing Date
2025-06-24
Publication Date
2026-08-01

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    Figure TWG2TA001070159_003
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Abstract

A method includes forming a photonic integrated circuit including: a first waveguide; a second waveguide over the first waveguide, wherein the second waveguide is optically coupled to the first waveguide; a first external coupler that is optically coupled to the second waveguide; and a first interconnect structure; attaching an electronic die to a first side of the photonic integrated circuit; direct bonding a first photonic die to a second side of the photonic integrated circuit, wherein the first photonic die is optically coupled to the first waveguide after the direct bonding; and forming a second interconnect structure over the first photonic die and the photonic integrated circuit.
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