Semiconductor structure and method of forming the same

TW202632345APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-07-04
Publication Date
2026-08-01

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Abstract

A method of forming a semiconductor structure includes: performing a first etch on a substrate, wherein the substrate includes six cross sections arranged in sequence to define five zones along a first direction, wherein the first etch forms a first protrusion region extending from the first to fifth zones and two first connecting regions on two sides of the first protrusion region; performing a second etch on the two first connecting regions to form a strip waveguide along the sixth cross section; performing a third etch on the two first connecting regions to form a rib waveguide along the third cross section; and performing a fourth etch on the two first connecting regions to form a deep-rib waveguide along the first cross section.
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