Photonic semiconductor packages and method of forming the same and photonic device
TW202632346APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2025-09-03
- Publication Date
- 2026-08-01
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Figure TWG2TA001070324_001 
Figure TWG2TA001070324_002 
Figure TWG2TA001070324_003
Abstract
A device includes a photonic layer that includes a waveguide and a grating coupler, wherein the waveguide is optically coupled to the grating coupler; an interconnect structure over the photonic layer; an electronic die bonded to the interconnect structure; and a support over the electronic die, wherein the support includes a metalens, wherein the metalens is optically coupled to the grating coupler.
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