Optical fiber apparatus and fiber-chip coupling arrangement

TW202632348APending Publication Date: 2026-08-01ADVANCED MICRO FOUNDRY PTE LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-22
Publication Date
2026-08-01

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Abstract

The present disclosure relates to an integrated photonic device, specifically an efficient fiber-chip coupling structure or arrangement in which an optical fiber has at least two facet cuts that are made or configured to efficiently transmit an optical field from / to an optical chip. The efficient fiber-chip coupling arrangement may be part of an optical coupling setup used in, for example, optical wafer level testing applications. The optical fiber may optionally include an additional facet cut that is made or configured to provide improved visualisation of an optical alignment edge of the optical fiber during alignment with the optical chip or other elements.
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