Integrated optical elements and their assembly methods

Abstract

An integrated optical element for receiving an optical signal includes a carrier plate, a semiconductor optical device, at least one array of optical elements, and a bonding and fixing material. The carrier plate has an upper surface. The semiconductor optical device is disposed on the upper surface. The array of optical elements is arranged above the upper surface in front of the semiconductor optical device along a planar direction and aligned with the semiconductor optical device along an optical axis. The bonding and fixing material is disposed on the upper surface and supports the array of optical elements. Before the bonding and fixing material fixes the array of optical elements to the carrier plate, the array of optical elements is arranged in space and spaced apart from the upper surface by a plurality of temporary support structures, and the support structures are removed after the bonding and fixing material is fixed to the upper surface and cured.

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