Camera device

Abstract

A camera device includes a circuit board, a spacer, a lens module, and a sealing ring. The circuit board has an assembly surface and a photosensitive element. The spacer is disposed on the assembly surface. The lens module is disposed on the spacer. The sealing ring includes an annular body and an elastic ring. The annular body is connected to the spacer. The elastic ring surrounds the photosensitive element. The elastic ring has a root portion and an end portion. The root portion is connected to the annular body. The end portion contacts the assembly surface. The elastic ring is not perpendicular to the assembly surface of the circuit board.

Description

[Technical Field]

[0001] This invention relates to an optical device, and more particularly to a camera device. [Previous Technology]

[0002] With the development of technology, camera devices are increasingly used in fields such as personal electronic products, automobiles, and medicine to capture external images. In order to prevent external light, dust or foreign objects from entering the camera device and affecting the image quality, camera devices usually use sponge to fill the gaps between components.

[0003] However, when using sponge material for sealing, the porous structure of the sponge may contain tiny dust particles that are difficult to remove. Over time, the dust will gradually accumulate and eventually enter the camera device, affecting the optical imaging quality. [Summary of the Invention]

[0004] In view of the above, in one embodiment, a camera device is provided, including a circuit board, a spacer, a lens module, and a sealing ring. The circuit board has an assembly surface and a photosensitive element. The spacer is disposed on the assembly surface. The lens module is disposed on the spacer. The sealing ring includes an annular body and an elastic ring. The annular body is connected to the spacer, and the elastic ring surrounds the photosensitive element. The elastic ring has an opposing root and an end. The root is connected to the annular body, and the end contacts the assembly surface of the circuit board. The elastic ring is not perpendicular to the assembly surface of the circuit board.

[0005] In summary, according to the imaging device of the present invention, the elastic ring of the sealing ring surrounds the photosensitive element, and the end of the elastic ring contacts the assembly surface of the circuit board, which can prevent external light, dust or foreign objects from entering and affecting the imaging quality of the photosensitive element. In addition, by not perpendicular to the assembly surface of the circuit board, the elastic ring can prevent excessive pressure on the circuit board or lens module after assembly, thereby preventing deformation of the circuit board or lens module.

Implementation Method

[0006] It should be noted that in the descriptions of the various embodiments, the terms "first" and "second" are used to describe different elements, and these elements are not limited by such predicates. Furthermore, for ease of explanation and clarity, the thickness or dimensions of each element in the drawings are exaggerated, omitted, or approximated for the understanding and reading of those skilled in the art. The dimensions of each element are not exactly its actual dimensions and are not intended to limit the implementation conditions of the invention; therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content disclosed in this invention. The same reference numerals will be used to denote the same or similar elements in all drawings.

[0007] Figure 1 is a perspective view of an embodiment of the camera device of the present invention, and Figure 2 is an exploded perspective view of an embodiment of the camera device of the present invention. As shown in Figures 1 and 2, the camera device 1 of this embodiment includes a circuit board 10, a fixing adhesive layer 12, a spacer 20, a lens module 30, and a sealing ring 40. In some embodiments, the camera device 1 can be applied to various electronic products to capture images around the electronic products. For example, the camera device 1 can be applied to automotive products (such as dashcams, reversing cameras, or surround view systems), mobile devices (such as smartphones, tablets, or laptops), or cameras and other electronic products.

[0008] As shown in Figures 1 and 2, the circuit board 10 has an assembly surface 11 and a photosensitive element 15. In this embodiment, the photosensitive element 15 is disposed on the assembly surface 11 of the circuit board 10. For example, the photosensitive element 15 can be fixed to the assembly surface 11 by means of adhesive, snap-fit ​​or locking, but this is not limited. In some embodiments, the photosensitive element 15 can also be disposed inside the holes of the circuit board 10.

[0009] In some embodiments, the photosensitive element 15 may be a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a CMOS active pixel sensor, used to sense and acquire images.

[0010] As shown in Figures 1 and 2, the adhesive layer 12 is disposed on the assembly surface 11 of the circuit board 10, and the adhesive layer 12 and the photosensitive element 15 are spaced apart from each other. Furthermore, the number of adhesive layers 12 can be one or more, and the shape of the adhesive layer 12 is not limited. For example, in this embodiment, the adhesive layer 12 is elongated and there are two of them. The two adhesive layers 12 are respectively located on opposite sides of the photosensitive element 15 and are respectively adhered to a local area of ​​the assembly surface 11 of the circuit board 10. In some embodiments, the number of adhesive layers 12 can also be one. For example, the adhesive layer 12 can be an annular adhesive layer surrounding the photosensitive element 15.

[0011] As shown in Figures 1 and 2, the spacer 20 is disposed on the assembly surface 11 of the circuit board 10. The spacer 20 can be a plate or a gasket, and the spacer 20 can be integrally formed or assembled from multiple plates or sheets. In this embodiment, the spacer 20 has a first surface 21 and a second surface 22 facing each other, wherein the first surface 21 faces the circuit board 10 and the second surface 22 faces the lens module 30. The first surface 21 of the spacer 20 is attached to the fixing adhesive layer 12, so that the spacer 20 is fixed to the assembly surface 11 of the circuit board 10 through the fixing adhesive layer 12. In addition, there are two fixing adhesive layers 12 in this embodiment. The two fixing adhesive layers 12 are respectively adhered to a local area of ​​the first surface 21 of the spacer 20 (here, the two opposite sides of the first surface 21), but the present invention is not limited thereto.

[0012] As shown in Figures 1 and 2, in this embodiment, the spacer 20 is annular and has a central through hole 201. When the spacer 20 is assembled on the assembly surface 11 of the circuit board 10, the position of the photosensitive element 15 can correspond to the position of the central through hole 201, or the photosensitive element 15 can be located inside the central through hole 201, so that the photosensitive element 15 can receive external light without being blocked by the spacer 20.

[0013] Figure 3 is a disassembled schematic diagram of the lens module of the camera device of the present invention. As shown in Figures 1 to 3, the lens module 30 is disposed on the spacer 20 and covers the photosensitive element 15. The lens module 30 may include at least one lens (not shown). The lens can be used to focus external light, so that the external light can be transmitted to the photosensitive element 15 through the lens module 30, thereby allowing the photosensitive element 15 to sense and acquire an image. In this embodiment, the lens module 30 is detachably assembled to the spacer 20, so that the lens module 30 does not directly contact each fixing adhesive layer 12. That is to say, the spacer 20 is not part of the original lens module 30. The spacer 20 is an independent component used to separate the lens module 30 from each fixing adhesive layer 12, and the lens module 30 can be detached from the spacer 20 at any time.

[0014] Accordingly, as shown in Figures 2 and 3, since the unit price of the lens module 30 is relatively high, the embodiment of the present invention uses the spacer 20 to block the lens module 30 from the fixing adhesive layer 12, and the lens module 30 is detachably assembled to the spacer 20. When the lens module 30 malfunctions during production, testing or use, the lens module 30 can be easily removed from the spacer 20 (as shown in Figure 3) for repair or readjustment, thereby effectively reducing the scrap rate, material usage and production cost without having to replace the entire lens module 30.

[0015] In some embodiments, the lens module 30 and the spacer 20 can be assembled by means of snap-fit, locking, or screwing, so that the lens module 30 will not be damaged during the process of removing the spacer 20. As shown in Figures 2 and 3, in this embodiment, the spacer 20 has one or more first assembly parts 25. Here, there are four first assembly parts 25, which are respectively adjacent to the four corners of the spacer 20. The side of the lens module 30 facing the circuit board 10 has a second assembly part 31. The number and position of the second assembly parts 31 correspond to the number and position of the first assembly parts 25 of the spacer 20. Each first assembly part 25 of the spacer 20 and each second assembly part 31 of the lens module 30 can be assembled with each other. The circuit board 10 has a cutout portion 16. The number and position of the cutout portion 16 correspond to the number and position of the first assembly portion 25 of the spacer 20, so that when the lens module 30 needs to be removed from the spacer 20, the operator can easily complete the disassembly through the cutout portion 16. For example, the operator can insert a hand tool into the cutout portion 16 to separate each of the first assembly portion 25 of the spacer 20 from each of the second assembly portion 31 of the lens module 30.

[0016] As shown in Figures 2 and 3, in this embodiment, each of the first assembly parts 25 of the spacer 20 and each of the second assembly parts 31 of the lens module 30 are holes, and a fixing member 50 is connected to each of the first assembly parts 25 and each of the second assembly parts 31. For example, the fixing member 50 can be a rivet, screw or bolt, so that the spacer 20 and the lens module 30 are connected and fixed to each other, and the lens module 30 can still be detached from the spacer 20 without being damaged.

[0017] Figure 4 is an exploded perspective view of another embodiment of the camera device of the present invention. As shown in Figure 4, the assembly structure of the spacer 20 and the lens module 30 can also be located on the outer periphery of both. Therefore, when the lens module 30 needs to be detached from the spacer 20, the operator can disassemble the assembly structure from around the camera device 1, eliminating the need for the cutout portion 16 on the circuit board 10. For example, in this embodiment, the outer periphery of the spacer 20 has one or more first assembly members 26. Here, there are four first assembly members 26 spaced apart from each other. The outer periphery of the lens module 30 has second assembly members 32. The number and position of the second assembly members 32 correspond to the number and position of the first assembly members 26 of the spacer 20. Each first assembly member 26 of the spacer 20 and each second assembly member 32 of the lens module 30 can be assembled with each other.

[0018] As shown in Figure 4, in this embodiment, each of the first sets of connectors 26 of the spacer 20 is a fastener, and each of the first sets of connectors 26 is integrally connected to the outer periphery of the spacer 20. Each of the second sets of connectors 32 of the lens module 30 is a fastening groove, and each of the first sets of connectors 26 is detachably fastened to each of the second sets of connectors 32, so that the spacer 20 and the lens module 30 are assembled and fixed together, and the lens module 30 can still be detached from the spacer 20 without being damaged. However, the above embodiment is only an example. In some embodiments, each of the first sets of connectors 26 and each of the second sets of connectors 32 may also have other different assembly structures, or the structures of each of the first sets of connectors 26 and each of the second sets of connectors 32 may be interchanged.

[0019] As shown in Figures 2 and 3, each fixing adhesive layer 12 on the assembly surface 11 of the circuit board 10 can be a light-curing adhesive layer (e.g., an ultraviolet light-curing adhesive layer), so that the lens module 30 can adjust the focal length by means of the fixing adhesive layer 12 during the assembly process. For example, before being exposed to light (e.g., ultraviolet light), the adhesive layer 12 may be in an uncured state. During the assembly of the camera device 1, the lens module 30 and the spacer 20 can be assembled together first. Then, the spacer 20 is placed on each of the uncured adhesive layers 12, and the spacer 20 is controlled to move up, down, sideways, tilt, or deflect relative to the circuit board 10 to adjust the relative position of the lens module 30 and the photosensitive element 15 for focusing. Next, when the central axis of the lens module 30 overlaps with the central axis of the photosensitive element 15 and the image sensed by the photosensitive element 15 is clear, the adhesive layers 12 can be irradiated with the aforementioned light to cure them, thereby fixing the spacer 20 to the assembly surface 11 of the circuit board 10 and fixing the relative position of the lens module 30 and the photosensitive element 15. However, the above embodiment is only an example. In some embodiments, each adhesive layer 12 may be other types of adhesive layers. Furthermore, after the spacer 20 moves relative to the circuit board 10 and the lens module 30 is focused, the spacer 20 and the circuit board 10 may not be parallel to each other, but this is not a limitation.

[0020] Figure 5 is a partially exploded perspective view of an embodiment of the imaging device of the present invention, Figure 6 is a cross-sectional view along line segment 6-6 of Figure 1, and Figure 7 is a partially enlarged view of region 7 of Figure 6. As shown in Figures 2, 3, and 5-7, when each fixing adhesive layer 12 on the assembly surface 11 of the circuit board 10 is a photocurable adhesive layer, the spacer 20 can be a light-transmitting spacer, for example, the spacer 20 as a whole can be transparent or translucent. Alternatively, a local area of ​​the spacer 20 can have a light-transmitting portion 202, and the position of the light-transmitting portion 202 corresponds to the position of the fixing adhesive layer 12 (for example, as shown in Figure 7). Thus, as mentioned above, during the process of irradiating light onto each fixing adhesive layer 12 of the imaging device 1, the light can penetrate the spacer 20 or the light-transmitting portion 202 without being blocked, making it easier for each fixing adhesive layer 12 to be exposed to light and cured.

[0021] As shown in Figures 6 and 7, one or more light-guiding slopes 24 may be provided between the first surface 21 and the second surface 22 of the spacer 20 to guide the light. The number and position of the light-guiding slopes 24 correspond to the number and position of the fixing adhesive layers 12. For example, in this embodiment, there are two light-guiding slopes 24, which are respectively adjacent to the two opposite sides of the spacer 20 to correspond to the two fixing adhesive layers 12. Each light-guiding slope 24 has an included angle (e.g., the included angle can be acute or obtuse) with the assembly surface 11 of the circuit board 10. When the light L enters from the two sides of the spacer 20, each light-guiding slope 24 can guide the light L to change the angle to concentrate the light on each fixing adhesive layer 12, so as to ensure that each fixing adhesive layer 12 can receive light smoothly. In addition, in this embodiment, the second surface 22 of the spacer 20 has two inner grooves 23, which are respectively adjacent to the two opposite sides of the spacer 20. The two light-guiding slopes 24 are respectively located in the two inner grooves 23, but the present invention is not limited thereto.

[0022] As shown in Figures 2 and 5-7, the spacer 20 may be an annular spacer with an annular groove 27, which is used for assembling the sealing ring 40. In this embodiment, the annular groove 27 is recessed in the second surface 22 of the spacer 20, surrounds the central through hole 201, and communicates with the central through hole 201. The shape of the annular groove 27 corresponds to the shape of the sealing ring 40. For example, the annular groove 27 and the sealing ring 40 may be square (as shown in Figure 5), circular, rectangular, elliptical, or other irregular shapes; this invention is not limited in these respects.

[0023] As shown in Figures 2 and 5-7, the sealing ring 40 includes an annular body 41 and an elastic ring 45. The sealing ring 40 may be made of an opaque material to block external light from entering the interior of the camera device 1. For example, the opaque material may be rubber, plastic, or a composite material (e.g., a composite material of rubber and plastic or rubber and metal). The sealing ring 40 may also have good corrosion resistance, high temperature resistance, elasticity, and flexibility. The annular body 41 is disposed in the annular groove 27 of the spacer 20. For example, the annular body 41 may be fixed in the annular groove 27 by means of fastening, locking, or adhesive. The annular body 41 has an inner surface 411 facing the assembly surface 11 of the circuit board 10. The elastic ring 45 extends into the central through hole 201 of the spacer 20 and surrounds the photosensitive element 15. The elastic ring 45 has a root 46, an end 47 and a flexible barrier 48. The root 46, the end 47 and the flexible barrier 48 are all annular. The flexible barrier 48 is integrally connected between the root 46 and the end 47. The elastic ring 45 can be integrally connected or assembled to the inner surface 411 of the annular body 41. For example, in this embodiment, the root 46 of the elastic ring 45 is integrally connected to the inner surface 411 of the annular body 41 and is integrally formed with the annular body 41. The flexible barrier 48 of the elastic ring 45 is not perpendicular to the assembly surface 11 of the circuit board 10. That is to say, there may be an angle between the flexible barrier 48 of the elastic ring 45 and the assembly surface 11 of the circuit board 10 (as shown in Figures 6 and 7, the angle may be acute or obtuse). The end 47 of the elastic ring 45 contacts the assembly surface 11 of the circuit board 10.

[0024] Accordingly, as shown in Figures 2 and 5-7, in this embodiment of the invention, the elastic ring 45 of the sealing ring 40 surrounds the photosensitive element 15, and the end 47 of the elastic ring 45 contacts the assembly surface 11 of the circuit board 10. This prevents external light, dust, or foreign objects from entering the interior of the imaging device 1 and affecting the imaging quality of the photosensitive element 15. Furthermore, because the flexible barrier 48 of the elastic ring 45 is not perpendicular to the assembly surface 11 of the circuit board 10, it further prevents the elastic ring 45 from exerting excessive pressure on the circuit board 10 or lens module 30 after assembly, thereby preventing deformation or displacement of the circuit board 10 or lens module 30, and ensuring that the image captured by the imaging device 1 maintains good quality.

[0025] Continuing from the above, specifically, as shown in Figures 2 and 5-7, the camera device 1 has an axial direction (the Z-axis direction in Figures 2, 5, and 6) and a vertical direction (the X-axis direction in Figures 2, 5, and 6), wherein the axial direction is perpendicular to the assembly surface 11 of the circuit board 10, and the vertical direction is perpendicular to the axial direction. After the camera device 1 is assembled, the lens module 30 will press against the sealing ring 40, causing the end 47 of the elastic ring 45 of the sealing ring 40 to press against the assembly surface 11 of the circuit board 10 and interfere with the assembly surface 11, thereby achieving the effect of preventing light and dust. Therefore, if the elastic ring 45 is perpendicular to the assembly surface 11 of the circuit board 10, the elastic ring 45 will exert pressure on the circuit board 10 and the lens module 30 in the aforementioned axial direction (the Z-axis direction in Figures 2, 5, and 6), causing the circuit board 10 or the lens module 30 to be deformed by pressure, thus affecting the imaging quality of the photosensitive element 15.

[0026] Based on the foregoing, in this embodiment of the invention, the flexible barrier 48 of the elastic ring 45 is not perpendicular to the assembly surface 11 of the circuit board 10. When the end 47 of the elastic ring 45 of the sealing ring 40 presses against the assembly surface 11 of the circuit board 10, the end 47 of the elastic ring 45 and the flexible barrier 48 can bend and deform. For example, as shown in Figures 6 and 7, when the end 47 of the elastic ring 45 presses against the assembly surface 11, the flexible barrier 48 can be bent by force to form an extension section 481 and a bent section 482. The extension section 481 is connected to the root 46, and the bent section 482 is connected between the extension section 481 and the end 47, thereby greatly reducing the pressure on the circuit board 10 and the lens module 30 in the aforementioned axial direction (as shown in the Z-axis direction in Figures 2, 5, and 6) to prevent the circuit board 10 or the lens module 30 from being deformed or displaced by force.

[0027] As shown in Figures 2 and 5 to 7, in this embodiment, the thickness of the elastic ring 45 of the sealing ring 40 in the vertical direction (X-axis direction in Figures 2, 5 and 6) can be less than the thickness of the annular body 41 in the vertical direction, so that the rigidity of the elastic ring 45 is less than that of the annular body 41 and it is easier to be deformed by force. As a result, when the end 47 of the elastic ring 45 of the sealing ring 40 presses against the assembly surface 11 of the circuit board 10, the pressure on the circuit board 10 and the lens module 30 in the axial direction (Z-axis direction in Figures 2, 5 and 6) can be further reduced.

[0028] As shown in Figures 2 and 5 to 7, the thickness of the end 47 of the elastic ring 45 of the sealing ring 40 may be different from the thickness of the root 46. For example, in this embodiment, the thickness of the end 47 of the elastic ring 45 in the vertical direction (X-axis direction in Figures 2, 5, and 6) is less than the thickness of the root 46 in the vertical direction. This can further reduce the rigidity of the end 47 of the elastic ring 45 and the rigidity of the flexible barrier 48 near the end 47, so that when the end 47 of the elastic ring 45 of the sealing ring 40 presses against the assembly surface 11 of the circuit board 10, the pressure on the circuit board 10 and the lens module 30 in the axial direction (Z-axis direction in Figures 2, 5, and 6) can be further reduced.

[0029] In some embodiments, the size of the root 46 of the elastic ring 45 of the sealing ring 40 may be different from the size of the end 47. As shown in Figures 2 and 6, in this embodiment, the root 46 and the end 47 of the elastic ring 45 of the sealing ring 40 are respectively square rings, and the side length W1 of the root 46 in the aforementioned vertical direction (the X-axis direction in Figures 2, 5, and 6) is smaller than the side length W2 of the end 47 in the aforementioned vertical direction, so that the elastic ring 45 is not perpendicular to the assembly surface 11 of the circuit board 10, and the root 46 is closer to the photosensitive element 15 relative to the end 47. Alternatively, as shown in Figure 8, which is a partial cross-sectional view of another embodiment of the imaging device of the present invention, in another embodiment, the side length W1 of the elastic ring 45 of the sealing ring 40 may also be greater than the side length W2 of the end 47, so that the end 47 is closer to the photosensitive element 15 relative to the root 46. However, the above embodiments are merely examples. In other embodiments, when the root 46 and the end 47 of the elastic ring 45 are respectively circular rings, the diameter of the root 46 may be different from the diameter of the end 47, so that the elastic ring 45 is not perpendicular to the assembly surface 11 of the circuit board 10.

[0030] In addition, as shown in Figures 6 and 7, in this embodiment, since the spacer 20 is attached to the fixing adhesive layer 12 on the assembly surface 11 of the circuit board 10, there is a gap space S between the spacer 20 and the assembly surface 11, and the end 47 of the elastic ring 45 of the sealing ring 40 can extend into the gap space S to enhance the light and dust protection effect.

[0031] As shown in Figures 2 and 5, the annular groove 27 of the spacer 20 may have one or more first limiting members 28. Here, the number of first limiting members 28 is multiple and they are spaced apart from each other. The annular body 41 of the sealing ring 40 has one or more second limiting members 42. The number and position of the second limiting members 42 correspond to the number and position of the first limiting members 28, and each second limiting member 42 is assembled to each first limiting member 28 to improve the stability of the sealing ring 40. In this embodiment, each first limiting member 28 in the annular groove 27 is a protruding post, and each second limiting member 42 in the annular body 41 is a through hole. Each first limiting member 28 passes through each second limiting member 42 to position the sealing ring 40 in the annular groove 27. However, the above embodiments are merely examples. In some embodiments, each first limiting member 28 and each second limiting member 42 may have other different assembly structures, or the structures of each first limiting member 28 and each second limiting member 42 may be interchanged.

[0032] As shown in Figures 2 and 5, in this embodiment, the annular groove 27 of the spacer 20 has an annular sidewall 271, and the annular sidewall 271 has one or more lateral grooves 272. Here, the number of lateral grooves 272 is multiple and they are spaced apart from each other. The annular body 41 of the sealing ring 40 has one or more protrusions 412 around its periphery. The number and position of the protrusions 412 correspond to the number and position of the lateral grooves 272, and each protrusion 412 is confined within each lateral groove 272 to further enhance the positioning effect of the sealing ring 40. In addition, in this embodiment, each of the second limiting members 42 of the annular body 41 is located on each protrusion 412, but the present invention is not limited thereto.

[0033] Although the technical content of the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be included within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0034] Figure 1 is a perspective view of an embodiment of the camera device of the present invention. Figure 2 is an exploded perspective view of an embodiment of the camera device of the present invention. Figure 3 is a disassembled schematic diagram of the lens module of the camera device of the present invention. Figure 4 is an exploded perspective view of another embodiment of the camera device of the present invention. Figure 5 is a partial exploded perspective view of an embodiment of the camera device of the present invention. Figure 6 is a cross-sectional view along line segment 6-6 of Figure 1. Figure 7 is a partial enlarged view of Figure 6. Figure 8 is a partial cross-sectional view of another embodiment of the camera device of the present invention.

Claims

1. A camera device, comprising: A circuit board having an assembly surface and a photosensitive element; A spacer is disposed on the assembly surface; a lens module is disposed on the spacer; and a sealing ring includes an annular body and an elastic ring. The annular body is connected to the spacer, and the elastic ring surrounds the photosensitive element. The elastic ring has a root and an end, the root being connected to the annular body and the end contacting the assembly surface of the circuit board. The elastic ring is not perpendicular to the assembly surface of the circuit board. The elastic ring of the sealing ring has a flexible barrier connected between the root and the end. The flexible barrier and the assembly surface of the circuit board have an angle, which is either acute or obtuse. The end of the elastic ring presses against the assembly surface of the circuit board, causing the end of the elastic ring and the flexible barrier to bend and deform.

2. The camera device as claimed in claim 1, wherein the annular body has an inner surface facing the assembly surface, and the root of the elastic ring is connected to the inner surface of the annular body.

3. The camera device as claimed in claim 1, wherein the thickness of the end of the elastic ring is different from the thickness of the root.

4. The camera device as claimed in claim 3, wherein the thickness of the end of the elastic ring is less than the thickness of the root.

5. The camera device as claimed in claim 1, wherein the root and the end are annular, and the size of the root is different from the size of the end.

6. The imaging device as claimed in claim 1, wherein the root portion is closer to the photosensitive element relative to the end portion.

7. The camera device as claimed in claim 1, wherein the flexible retaining wall of the elastic ring includes an extension and a bending section, the extension being connected to the root and the bending section being connected between the extension and the end.

8. The camera device as claimed in claim 1, wherein there is a gap between the spacer and the assembly surface of the circuit board, and the end of the elastic ring of the sealing ring extends into the gap.

9. The camera device as claimed in claim 8, wherein the assembly surface of the circuit board has a fixing adhesive layer, and the spacer is attached to the fixing adhesive layer such that the spacer and the assembly surface have the gap space.

10. The camera device as claimed in claim 1, wherein the spacer has an annular groove, and the annular body of the sealing ring is disposed within the annular groove.

11. The camera device as claimed in claim 10, wherein the annular groove of the spacer has a first limiting member, the annular body of the sealing ring has a second limiting member, and the second limiting member is assembled to the first limiting member.

12. The camera device as claimed in claim 11, wherein the first limiting member is a protrusion and the second limiting member is a through hole, the protrusion being disposed within the through hole.

13. The camera device as claimed in claim 10, wherein the annular groove has an annular sidewall having a lateral groove, and the annular body of the sealing ring has a protrusion around it, the protrusion being confined within the lateral groove.

14. A camera device, comprising: A circuit board having an assembly surface and a photosensitive element; A spacer is disposed on the assembly surface; a lens module is disposed on the spacer; and a sealing ring includes an annular body and an elastic ring, the annular body being connected to the spacer, the elastic ring surrounding the photosensitive element, the elastic ring having a root and an end opposite each other, the root being connected to the annular body, the end contacting the assembly surface of the circuit board, and the elastic ring not perpendicular to the assembly surface of the circuit board; wherein the spacer has an annular groove, the annular body of the sealing ring is disposed in the annular groove, the annular groove of the spacer has a first limiting member, the annular body of the sealing ring has a second limiting member, and the second limiting member is assembled to the first limiting member.

15. A camera device, comprising: A circuit board having an assembly surface and a photosensitive element; A spacer is disposed on the assembly surface; a lens module is disposed on the spacer; and a sealing ring includes an annular body and an elastic ring, the annular body being connected to the spacer, the elastic ring surrounding the photosensitive element, the elastic ring having a root and an end opposite each other, the root being connected to the annular body, the end contacting the assembly surface of the circuit board, and the elastic ring not perpendicular to the assembly surface of the circuit board; wherein the spacer has an annular groove, the annular body of the sealing ring is disposed in the annular groove, the annular groove has an annular sidewall, the annular sidewall having a lateral groove, and the annular body of the sealing ring has a protrusion around its periphery, the protrusion being confined within the lateral groove.

Images