Reflective photomask substrate, manufacturing method of reflective photomask substrate, reflective photomask, manufacturing method of reflective photomask

TW202632416APending Publication Date: 2026-08-01AGC INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
AGC INC
Filing Date
2025-11-21
Publication Date
2026-08-01

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Abstract

This invention provides a reflective photomask substrate with a relatively high etching rate for the absorber film compared to the etching rate for the protective film. The reflective photomask substrate of this invention sequentially comprises a substrate, a multilayer reflective film for reflecting EUV light, a protective film, and an absorber film. The absorber film contains platinum, the oxygen content of the absorber film is less than 20% of the total atoms of the absorber film, and the rhodium content in the outermost layer of the protective film on the absorber film side is 50% or more of the total atoms of the outermost layer.
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