Substrate processing method, substrate processing apparatus and recording medium

Abstract

The purpose of this invention is to obtain a well-shaped photoresist pattern using a developing fluid of gas or water mist. The substrate processing method of this invention involves supplying a developing fluid of gas or water mist to a substrate, and developing a metal-containing photoresist film formed on the substrate to form a pattern. The substrate processing method includes the following steps: a first heat treatment step of heat-treating the substrate after exposing the photoresist film along the pattern; a first developing step of supplying the developing fluid to the substrate after the first heat treatment step and removing a portion of the photoresist film in the depth direction; and a second developing step of supplying the developing fluid to the substrate after the first developing step in order to form the pattern, and removing the area of ​​the photoresist film removed in the first developing step in the depth direction until the developing is complete.

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