Photosensitive resin compositions, dry films, cured materials, and electronic components

Abstract

This invention provides a photosensitive resin composition capable of producing a cured material with excellent heat resistance, good resistance to thermal shock (flexibility) and external impact resistance, high reflectivity and excellent colorfastness, as well as excellent touch-drying properties and drying control range, and the resulting dry film, cured material and electronic components. The photosensitive resin composition comprises at least a two-component resin composition containing (A) a carboxyl-containing resin, (B) a difunctional polyether polyurethane acrylate, (C) a photosensitive monomer, (D) a photopolymerization initiator, (E) an antioxidant, and (F) an epoxy resin. The amount of (B) difunctional polyether polyurethane acrylate is greater than 1.2 parts by weight and less than 11 parts by weight, based on 100 parts by weight of the (A) carboxyl-containing resin (by weight, in solids).

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