Planarization method, planarization system, and article manufacturing method

Abstract

In a planarization method using a planarization system including a plurality of processing apparatuses, the planarization system is configured to be able to perform, using the plurality of processing apparatuses, at least two steps of forming a first planarizing film by bringing a superstrate into contact with a curable composition placed on a first substrate, and spin coating a liquid film of a curable composition on a second substrate using a spin coat method. The planarization method includes performing any one of the at least two steps to perform planarization of the first substrate or the second substrate.

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