A method for planarizing a layer of a semiconductor wafer substrate, a planarization tool for planarizing an associated semiconducting wafer substrate and a method for planarizing a top layer of a semiconducting wafer substrate

Abstract

Methods, systems, and tools for planarizing a layer of a semiconducting wafer substrate are disclosed. The topography of a field on the layer is measured, wherein the field has a surface area that is much smaller than the surface area of the substrate. A deposition pattern for obtaining a flat or planar surface is then determined. A curable material is deposited upon the field using the deposition pattern. The curable material is then imprinted with a field-sized superstrate to create a flat or planar surface. The curable material is then cured, for example by using a radiation source. The field-sized superstrate is then lifted off the cured material to obtain the planarized layer.

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