Substrate processing apparatus and substrate processing method

Abstract

[Topic] Properly remove the periphery of a metal-containing film formed on a substrate. [Solution] A substrate processing apparatus includes: a substrate holding section for holding and rotating a substrate having a metal photoresist coating film formed thereon; a first processing liquid supply section for supplying a first processing liquid to the surface of the substrate; a second processing liquid supply section for supplying a second processing liquid to the surface of the substrate; a third processing liquid supply section for supplying a third processing liquid to the surface of the substrate; a fourth processing liquid supply section for supplying a fourth processing liquid to the back side of the substrate; a fifth processing liquid supply section for supplying a fifth processing liquid to the back side of the substrate; a sixth processing liquid supply section for supplying a sixth processing liquid to the back side of the substrate; and a control section; the control section is configured to perform the following steps: a first step in which, while the substrate is rotated, the first processing liquid is supplied from the first processing liquid supply section to remove the coating film having a specific width area from the end of the substrate; and during the first step, the fourth processing liquid is supplied from the fourth processing liquid supply section to the back side of the substrate. The second step, following the first step, involves rotating the substrate while moving the second processing liquid supply unit from the end of the substrate toward the center of the substrate and supplying the second processing liquid to the portion of the substrate end where the coating film has been removed. During the second step, the fifth processing liquid is supplied to the back side of the substrate from the fifth processing liquid supply unit. The third step, following the second step, involves rotating the substrate while moving the second processing liquid supply unit from the center toward the end of the substrate and supplying the second processing liquid. During the third step, the fifth processing liquid is supplied to the back side of the substrate from the fifth processing liquid supply unit. The fourth step, following the third step, involves rotating the substrate while discharging the third processing liquid from the third processing liquid supply unit into a region of a specific width from the end of the substrate. During the fourth step, the sixth processing liquid is supplied to the back side of the substrate from the sixth processing liquid supply unit.

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