Alignment device, pattern forming device and alignment method

Abstract

The object of this invention is to effectively detect alignment marks during alignment performed in a pattern forming apparatus such as an exposure apparatus. The solution is an exposure apparatus 10, including a stage 45 on which a silicon wafer, i.e., a substrate W, is placed, and an alignment measurement device 60. A plurality of openings AT are provided on the substrate mounting surface 45S of the stage 45. Each opening AT has an opening size that accommodates patterned areas (grains) PT arranged in a grid pattern on the substrate W, and alignment marks AR.

Images