Semiconductor module
TW202632647APending Publication Date: 2026-08-01RES ASSOC FOR ADVANCED SYST
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- RES ASSOC FOR ADVANCED SYST
- Filing Date
- 2025-12-10
- Publication Date
- 2026-08-01
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Abstract
The present invention comprises a semiconductor module having a memory block having a via with a first diameter and having a plurality of memory chips stacked thereon, wherein the plurality of memory chips each have internal wiring having an opening with a second diameter, and the plurality of memory chips are stacked in cross-section offset from a reference position by different displacements from each other, and the via is in cross-section contacting a portion of the aforementioned opening of each of the plurality of memory chips.
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