A method for manufacturing a surface-mountable component for an electronic device and surface-mountable component

Abstract

This invention relates to a method (100) for manufacturing a surface-mountable component (10) for an electronic element, the method comprising the steps of: a) providing (110) a substrate sheet (12), wherein the substrate sheet (12) has a first side (14) having a first electrode portion and a second electrode portion (16, 18); b) applying (120) a third electrode portion and at least one fourth electrode portion (26) to the second side (30) of the substrate sheet (12); c) applying (130) a passivation layer (32) to the component portion (20); d) applying (140) a protective layer (34) to the passivation layer (32); e) separating (150) the substrate sheet (12) into a plurality of first substrate panels (36); f) applying (160) a metallization layer (48) to at least one surface (42) of the first substrate panel (36); g) Separate (170) the plurality of first substrate panels (36) into a plurality of individual substrates (46); h) Apply (180) at least one edge metallization layer (48) to the metallization layer (40) of at least one surface (42) of the jacket surface (50) of the first substrate panel (36), and apply it to the uppermost layer of the electrode portion (16, 18). The invention relates to a method (100) for manufacturing a surface-mountable component (10) for an electronic device, which comprises the following steps: a) Providing (110) a substrate sheet (12), wherein the substrate sheet (12) has a first side (14) with a first and a second electrode section (16, 18), b) Applying (120) a third electrode section and at least one fourth electrode section (26) to a second side (30) of the substrate sheet (12), c) Applying (130) a passivation layer (32) to the element section (20), d) Applying (140) a protective layer (34) to the passivation layer (32), e) Separating (150) the substrate sheet (12) into several first substrate panels (36), f) Applying (160) a metallization layer (48) to at least one surface (42) of the first substrate panel (36), g) Separating (170) the several first substrate panels (36) into several individual substrates (46),h) Applying (180) at least one edge metallization layer (48) and / or to the metallization layer (40) of the at least one surface (42) of the jacket surface (50) of the first substrate panel (36) and to the uppermost layer of the electrode section (16, 18).,

Images