Power inductor packaging structure and method of manufacturing the same

TW202632693APending Publication Date: 2026-08-01INPAQ TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
INPAQ TECHNOLOGY CO LTD
Filing Date
2025-01-16
Publication Date
2026-08-01

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    Figure TWG2TA001069489_003
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Abstract

The present invention provides a power inductor packaging structure and a method of manufacturing the same. The power inductor packaging structure includes a magnetic core structure, a coil structure, a packaging structure, a top conductive structure, a side conductive structure, a top insulating structure, a bottom insulating structure and a side insulating structure. The packaging structure is configured to encapsulate the magnetic core structure and the coil structure. The top conductive structure includes a first top electrode layer and a second top electrode layer which are arranged on the top of the packaging structure. The side conductive structure includes a first side conductive layer and a second side conductive layer respectively arranged on the first side and the second side of the packaging structure. The top insulating structure includes a top insulating layer disposed on the top of the packaging structure. The bottom insulating structure includes a bottom insulating layer disposed on the bottom of the packaging structure. The side insulation structure includes a first side insulation layer and a second side insulation layer respectively arranged on the third side and the fourth side of the packaging structure.
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