Inspection System
TW202632723APending Publication Date: 2026-08-01HITACHI HIGH TECH CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- HITACHI HIGH TECH CORP
- Filing Date
- 2026-01-20
- Publication Date
- 2026-08-01
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Abstract
This invention provides a technique for online inspection of semiconductor layers formed between stacked structures in semiconductor devices such as CFETs. When a plurality of semiconductor layers are irradiated with an electron beam, a computer system measures the brightness of each semiconductor layer, acquires first image data containing the plurality of semiconductor layers, calculates statistical data on the brightness of each semiconductor layer, and determines the presence or absence of defects in the plurality of semiconductor layers based on the deviations in brightness from the statistical data.
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