Gas injector assembly with improved gas mixing
The gas dispensing insert with randomly oriented openings and multiple stages enhances mixing in semiconductor processing chambers, addressing non-uniform deposition issues by promoting turbulent flow and improving deposition uniformity.
TW202632733APending Publication Date: 2026-08-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114135685
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-26
- Filing Date
- 2025-09-17
- Publication Date
- 2026-08-01
AI Technical Summary
Technical Problem
Current gas injectors in semiconductor manufacturing processing chambers fail to ensure effective gas mixing homogeneity across a wide range of process pressures, leading to non-uniform thin film deposition and inefficient mixing due to centrifugal forces creating molecular separation and laminar flow.
Method used
A gas dispensing insert with randomly oriented gas openings and multiple gas injection stages that disrupt laminar flow, promoting turbulent mixing within the processing chamber without the need for mechanical mixers, enhancing gas distribution and co-flow efficiency.
Benefits of technology
Improves gas mixing efficiency across varying pressures, ensuring uniform thin film deposition and reducing issues like cold spots and rapid cleanup limitations in ALD processes.
✦ Generated by Eureka AI based on patent content.
Abstract
Gas distribution inserts configured to deliver a gas in semiconductor manufacturing processing chambers are described. The gas distribution insert comprises a plurality of randomly oriented gas openings extending through the thickness of the inlet end wall. An inner gas channel extends from the outlet end wall face to the insert outlet end, and the inner gas channel is bounded by an inner gas channel sidewall. The gas distribution inserts include at least two gas inlets extending through the inner gas channel sidewall.
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