Substrate processing apparatus and inspection method for substrate processing apparatus
TW202632734APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-09-23
- Publication Date
- 2026-08-01
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Figure TWG2TA001070507_001 
Figure TWG2TA001070507_002 
Figure TWG2TA001070507_003
Abstract
The substrate processing apparatus includes a chamber, a plurality of units, and a higher-level control unit. The chamber is located in the central region along the height direction of the substrate processing apparatus. The plurality of units are located above and below the chamber, and each unit is configured to have a control unit capable of performing self-checks on each unit before assembly into the substrate processing apparatus. The higher-level control unit is configured to manage the aforementioned control units of each of the plurality of units after the plurality of units are assembled into the substrate processing apparatus. Furthermore, the control units of the plurality of units can perform self-checks on each unit after assembly into the substrate processing apparatus. Additionally, the higher-level control unit can perform checks as a substrate processing apparatus after assembly into the substrate processing apparatus.
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