Plasma processing systems with direct current voltage for plasma energy control
TW202632739APending Publication Date: 2026-08-01APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2025-10-01
- Publication Date
- 2026-08-01
Smart Images

Figure TWG2TA001070648_001 
Figure TWG2TA001070648_002 
Figure TWG2TA001070648_003
Abstract
Methods and apparatus for processing a substrate using a plasma processing system. One example plasma processing system generally includes a first electrode, a second electrode, and a system controller comprising one or more processors and memory that includes computer-executable instructions. The one or more processors are generally configured to execute the computer-executable instructions and cause the plasma processing system to: deliver, using a first radio frequency (RF) generator, a first RF waveform to the first electrode at a first RF frequency, and adjust, using a direct current (DC) supply, a voltage applied to the second electrode during the delivery of the first RF waveform.
Need to check novelty before this filing date? Find Prior Art