Plasma processing systems with direct current voltage for plasma energy control

TW202632739APending Publication Date: 2026-08-01APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-10-01
Publication Date
2026-08-01

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Abstract

Methods and apparatus for processing a substrate using a plasma processing system. One example plasma processing system generally includes a first electrode, a second electrode, and a system controller comprising one or more processors and memory that includes computer-executable instructions. The one or more processors are generally configured to execute the computer-executable instructions and cause the plasma processing system to: deliver, using a first radio frequency (RF) generator, a first RF waveform to the first electrode at a first RF frequency, and adjust, using a direct current (DC) supply, a voltage applied to the second electrode during the delivery of the first RF waveform.
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