Substrate processing apparatus and temperature control method

Abstract

The substrate processing apparatus disclosed in this invention includes a component for which temperature control is desired, a heating mechanism for the component, a cooling mechanism for the component, a temperature sensor, and a temperature control unit. The temperature control unit includes a PID calculation unit, a feedforward control unit, and a synthesis unit. The PID calculation unit is configured to obtain a first operating quantity based on the error between a measured temperature value of the component obtained by the temperature sensor and a set temperature value of the component through PID calculation. The feedforward control unit is configured to output a second operating quantity corresponding to an amount of interfering heat input to the component. The synthesis unit is configured to output a synthesized operating quantity to the heating mechanism and / or the cooling mechanism, the synthesized operating quantity being obtained by combining the first operating quantity and the second operating quantity.

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