Constraint ring assembly, plasma treatment apparatus and method

Abstract

This invention provides a confinement ring assembly, a plasma processing apparatus, and a method. The confinement ring assembly is disposed within the vacuum reaction chamber of the plasma processing apparatus to confine the plasma region, and includes: a first sub-ring and a second sub-ring; the second sub-ring is closer to the exhaust system than the first sub-ring; the first sub-ring is disposed within the plasma region; the first sub-ring reduces the plasma pressure from a first pressure to a second pressure, thereby extinguishing the plasma at the second sub-ring. The advantage of this invention is that the confinement ring assembly has a large conductivity, effectively confining the plasma while avoiding particle contamination of the wafer.

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