Lower electrode assembly, plasma treatment equipment and its voltage control method
TW202632749APending Publication Date: 2026-08-01ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ADVANCED MICRO FAB EQUIP INC CHINA
- Filing Date
- 2025-12-29
- Publication Date
- 2026-08-01
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Abstract
This invention provides a lower electrode assembly, a plasma processing device, and a voltage control method thereof. A first DC pulse voltage is coupled to a first circuit of a focusing ring through a first bias power supply, and a first capacitor is connected in series. The capacitance value of the first capacitor is used to adjust the first slope corresponding to the voltage change of the focusing ring, thereby reducing the voltage difference between the substrate and the focusing ring and effectively reducing the risk of arc discharge between the substrate and the focusing ring.
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