Wiring board and method for manufacturing wiring board

Abstract

The wiring substrate of the present invention comprises: a substrate having transparency; a base coating disposed on the substrate; and a grid wiring layer disposed on the base coating, comprising a plurality of first-direction wirings and a plurality of second-direction wirings connecting the plurality of first-direction wirings. The base coating comprises a polymer material. At least one of the four corners formed between the first-direction wirings and the second-direction wirings at the intersection of the first-direction wirings and the second-direction wirings is rounded when viewed from above.

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