Semiconductor package apparatus, power circuit, and method of forming semiconductor package

TW202632788APending Publication Date: 2026-08-01SEMICON COMPONENTS IND LLC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SEMICON COMPONENTS IND LLC
Filing Date
2025-07-28
Publication Date
2026-08-01

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    Figure TWG2TA001070226_003
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Abstract

An apparatus includes a base, a tip, and a body region disposed between the base and the tip. The apparatus further includes a flange disposed on a top of a moving component and a biasing component coupled to the moving component. The moving component is configured to slide on the body region, and the biasing component is configured to bias the flange upward against a surface.
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