Compression contact interface assembly and connector assembly
TW202632792APending Publication Date: 2026-08-01MOLEX INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-10-01
- Publication Date
- 2026-08-01
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Abstract
This invention describes a press-fit contact interface assembly for high-speed data communication. An example assembly includes: an intermediary assembly; a ring body for securing the intermediary assembly to a printed circuit board; a plug connector that mats with the intermediary assembly; and a clamping clamp extending from the plug connector, snapping into the ring body, and securing the plug connector to the intermediary assembly. The intermediary assembly includes an intermediary housing and an intermediary conductive pad located on a mating interface region of the intermediary housing. The plug connector includes a plug housing and a plug conductive pad located on a mating interface of the plug housing. The ring body spans across the printed circuit board and presses the intermediary assembly downwards onto the top surface of the printed circuit board. The conductive pad provides additional shielding, and the intermediary housing and the intermediary conductive pad form a ground return path for data communication via the interface assembly.
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