Connector device and heat dissipation structure for the same

Abstract

A heat dissipation structure is configured to reduce temperature rise of a card. The heat dissipation structure has a board, a connector device and a heat dissipation member. The board is formed with a through hole. The connector device has a card connector and a bracket made of metal. The card connector is configured to accommodate the card and is mounted on the board in an up-down direction. The card connector has a shell. The shell has an upper plate. The bracket has a terminal and a cover. The terminal is soldered in the through hole of the board. The cover of the bracket is connected to the upper plate of the shell. The heat dissipation member is connected to the cover.

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