Package and piezoelectric vibrating device, and manufacturing method of piezoelectric vibrating device.
TW202632892APending Publication Date: 2026-08-01SII CRYSTAL TECHNOLOGY INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SII CRYSTAL TECHNOLOGY INC
- Filing Date
- 2025-10-09
- Publication Date
- 2026-08-01
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Abstract
[Problem] To mount a piezoelectric vibrator with high mounting accuracy. [Solution] A package is provided, comprising: a package body (10); a mounting portion (33) supporting the piezoelectric vibrator via a conductive adhesive (42); mounting electrodes (40) electrically connected to the piezoelectric vibrator by forming a pattern of metal material on the surface of the mounting portion; the mounting electrodes are formed in such a way that they have a shape pattern in a plan view of the package body that is different from the overall shape of the mounting portion; at least a portion of the mounting electrodes is an alignment pattern (90) formed with a predetermined specific pattern.
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