Package and piezoelectric vibrating device, and manufacturing method of piezoelectric vibrating device.

TW202632892APending Publication Date: 2026-08-01SII CRYSTAL TECHNOLOGY INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SII CRYSTAL TECHNOLOGY INC
Filing Date
2025-10-09
Publication Date
2026-08-01

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Abstract

[Problem] To mount a piezoelectric vibrator with high mounting accuracy. [Solution] A package is provided, comprising: a package body (10); a mounting portion (33) supporting the piezoelectric vibrator via a conductive adhesive (42); mounting electrodes (40) electrically connected to the piezoelectric vibrator by forming a pattern of metal material on the surface of the mounting portion; the mounting electrodes are formed in such a way that they have a shape pattern in a plan view of the package body that is different from the overall shape of the mounting portion; at least a portion of the mounting electrodes is an alignment pattern (90) formed with a predetermined specific pattern.
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