Circuit components and backplane

Abstract

A circuit device and a backplane are provided. The circuit device (31) is used to provide drive signals to N components and includes: an insulating substrate (100), a circuit layer disposed on the insulating substrate (100), and a connection pad layer. The circuit layer includes: N drive sub-circuits (11) and M cascaded first control circuits (12); the N drive sub-circuits are connected to the M cascaded first control circuits; the orthographic projection of the N drive sub-circuits on the insulating substrate is located on at least one side of the orthographic projection of the M cascaded first control circuits on the insulating substrate. The connection pad layer is located on the side of the circuit layer away from the insulating substrate, and the surface of the connection pad layer away from the insulating substrate is at least partially exposed. The connection pad layer includes: P connection pads, the P connection pads being connected to the N drive sub-circuits and the M cascaded first control circuits respectively; wherein, P > N + N / M + 2, M < N, and P, N, and M are all positive integers greater than 1.

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