Substrate processing apparatus and upper electrode assembly

TW202633018APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-11-11
Publication Date
2026-08-01

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Abstract

The substrate processing apparatus disclosed in this invention includes a chamber, a substrate support, and an upper electrode assembly. The substrate support is disposed within the chamber. The upper electrode assembly is disposed above the substrate support. The upper electrode assembly includes a top plate, a support body, and a rod assembly. The support body is disposed above the top plate. The rod assembly includes an upper part supported by the support body and a rod extending downward from the upper part. The rod supports the top plate in a manner that allows it to deform laterally along a direction intersecting the vertical.
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