Composite sheet
TW202633022APending Publication Date: 2026-08-01NITTO DENKO CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-09-22
- Publication Date
- 2026-08-01
Smart Images
Figure 00000000_0000_ABST
Abstract
The assembly sheet 1 of the present invention includes a wiring circuit board 2 and alignment marks 4. The alignment marks 4 have: a metal layer 40; a first mark 41 disposed on one side surface S11 of the metal layer 40, comprising the same material as the base insulating layer 23 of the wiring circuit board 2; and a second mark 42 disposed on one side surface S11 of the metal layer 40, comprising the same material as the first conductor pattern 24 of the wiring circuit board 2.
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