Flexible circuit board, cof module, and electronic device including same
TW202633023APending Publication Date: 2026-08-01LG INNOTEK CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-10-03
- Publication Date
- 2026-08-01
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Figure TWG2TA001070695_001 
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Figure TWG2TA001070695_003
Abstract
A flexible circuit board according to an embodiment includes a substrate; an upper wiring pattern part disposed on the substrate; and an upper protective layer disposed on the upper wiring pattern part and including a plurality of open regions, wherein the upper wiring pattern part includes: an upper wiring layer disposed on the substrate; a first upper plating layer disposed on the upper wiring layer; and a second upper plating layer disposed on the first upper plating layer, wherein the upper protective layer is disposed on the first upper plating layer of the upper wiring pattern part and does not contact the upper wiring layer, and wherein the second upper plating layer is disposed on the first upper plating layer in the plurality of open regions of the upper protective layer.
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