Laminated substrate, wiring substrate, method of manufacturing laminated substrate, method of manufacturing wiring substrate, and semiconductor package

Abstract

This disclosure provides a multilayer substrate that can mitigate stress and reduce crack formation in an inorganic substrate containing glass. The multilayer substrate (100) of this invention has a plurality of wiring substrates (110), each wiring substrate (110) comprising: an inorganic substrate (10) containing glass; one or more insulating resin layers (2) arranged to cover at least a portion of the inorganic substrate (10) containing glass; and wiring portions (3) disposed on the surface of at least one of the inorganic substrate (10) containing glass and the insulating resin layer (2); wherein the average thickness of each insulating resin layer (2) is 2 μm or more and less than 30 μm.

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