Wiring substrate, method of manufacturing wiring substrate, and semiconductor package

Abstract

This disclosure provides a wiring substrate that can reduce debris and cracking of the insulating resin layer. The wiring substrate (110) disclosed herein has: an inorganic substrate (10) including glass; one or more insulating resin layers (21, 22) arranged to cover at least a portion of the inorganic substrate (10) including glass; and wiring portions (3) disposed on the surface of at least one of the inorganic substrate (10) including glass and the insulating resin layers (21, 22); and the arithmetic surface roughness Sa of the end face of at least one of the insulating resin layers (21, 22) is 0.05 μm or more and 0.20 μm or less.

Images