Circuit board structure and manufacturing method thereof

Abstract

A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a first circuit pattern, a second circuit pattern, and a dielectric layer. The first circuit pattern is disposed on the substrate, wherein the first circuit pattern has a first circuit density. The second circuit pattern is disposed on the substrate, wherein the second circuit pattern has a second circuit density, and the second circuit density is smaller than the first circuit density. The dielectric layer includes a first portion and a second portion. The first portion covers the first circuit pattern, wherein the first portion and the first circuit pattern together have a first thickness t1. The second portion covers the second circuit pattern, wherein the second portion and the second circuit pattern together have a second thickness t2, and │(t1-t2)│ / (t1+t2)≦20%.

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