Hybrid circuit board

Abstract

The present invention provides a hybrid circuit board, which includes a ceramic core layer and two stacked layers that are respectively formed on two opposite sides of the ceramic core layer. The ceramic core layer includes a ceramic substrate and a connection circuit formed on the ceramic substrate. The ceramic substrate has a thru-hole, and the connection circuit has an embedded segment fully embedded in the thru-hole and two connection segments that are respectively connected to two opposite ends of the embedded segment. Each of the stacked layers includes a dielectric layer formed on the ceramic substrate and a circuit that is embedded in the dielectric layer. In each of the two stacked layers, one end of the circuit is connected to one of the two connection segments of the connection circuit, and another end of the circuit is exposed from the dielectric layer. The circuits of the two stacked layers are electrically coupled to each other through the connection circuit.

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