Substrate structure and manufacturing method thereof
TW202633031APending Publication Date: 2026-08-01AALTOSEMI INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- AALTOSEMI INC
- Filing Date
- 2025-02-10
- Publication Date
- 2026-08-01
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Figure TWG2TA001069990_001 
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Figure TWG2TA001069990_003
Abstract
A substrate structure is provided, the substrate structure comprises: a core layer having a plurality of conductive structures; a first build-up structure provided on the core layer and having a plurality of first conductive pillars; and a second build-up structure provided on the first build-up structure and having a plurality of second conductive pillars; wherein the first conductive pillar and the conductive structure areoffset from each other, and the second conductive pillar is aligned with the conductive structure and is offset from the first conductive pillar. The present disclosure further provides a manufacturing method of the substrate structure.
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