Substrate structure and manufacturing method thereof

TW202633031APending Publication Date: 2026-08-01AALTOSEMI INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
AALTOSEMI INC
Filing Date
2025-02-10
Publication Date
2026-08-01

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    Figure TWG2TA001069990_003
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Abstract

A substrate structure is provided, the substrate structure comprises: a core layer having a plurality of conductive structures; a first build-up structure provided on the core layer and having a plurality of first conductive pillars; and a second build-up structure provided on the first build-up structure and having a plurality of second conductive pillars; wherein the first conductive pillar and the conductive structure areoffset from each other, and the second conductive pillar is aligned with the conductive structure and is offset from the first conductive pillar. The present disclosure further provides a manufacturing method of the substrate structure.
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