Manufacturing method of wiring circuit board, manufacturing system of wiring circuit board, and electroplating equipment

Abstract

The manufacturing method of the wiring circuit board 1 of the present invention includes a seed layer formation step and a conductor layer formation step. In the seed layer formation step, a seed layer 31 covering the inner surface of the recess R1 is formed on a substrate S having a recess R1. In the conductor layer formation step, a conductor layer 32 is formed on the seed layer 31. The conductor layer formation step includes a first plating step, a surface treatment step, and a second plating step. In the first plating step, a portion of the conductor layer 32 (conductor layer 32A) is formed by electrolytic plating. In the surface treatment step, the surface of the conductor layer 32A is treated using a treatment solution containing acid. In the second plating step, a portion of the conductor layer 32 is further formed on the surface-treated conductor layer 32A by electrolytic plating.

Images