Manufacturing method of circuit board

Abstract

[Problem] To provide a method for manufacturing a circuit board having a fine and thin insulating layer. [Solution] A method for manufacturing a circuit board, the method comprising, in sequence: a step of forming a resin pattern by dispensing a resin composition onto a substrate using a jet dispensing machine; a step of forming an insulating pattern by curing the resin pattern; a step of forming a conductor layer on the substrate and the insulating pattern using an electrolytic plating method; and a step of forming a conductor pattern by removing a portion of the conductor layer; wherein the resin composition is a resin composition comprising a thermosetting resin, an organic solvent, an inorganic filler, and a thermoplastic resin; when all components in the resin composition are set to 100% by mass, and the mass percentage of the organic solvent is set to X (mass%), the mass percentage of the inorganic filler is set to Y (mass%), and the mass percentage of the thermoplastic resin is set to Z (mass%), the relationship X ≥ 30 and X / Y + X / Z < 10 is satisfied.